US 11,058,038 B2Granted

Electromagnetic shields for sub-modules

AssigneeQorvo US, Inc.

InventorsKelly M. Lear, Thomas Scott Morris, Jeffrey Miller, Jeffrey Dekosky

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Abstract

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Claims20

Dependent claims

A method comprising:

mounting a plurality of electronic components to a mounting face of a substrate structure;
depositing an overmold material to cover the plurality of electronic components;
removing portions of the overmold material along a plurality of first separation lines that define a plurality of modules, the removing along the plurality of first separation lines forming first openings that are configured to extend to a first horizontal plane that is within the substrate structure;
removing portions of the overmold material along a plurality of second separation lines that at least partially define a plurality of sub-modules within each module of the plurality of modules, the removing along the plurality of second separation lines forming second openings that are configured to extend to a second horizontal plane that is within the substrate structure, wherein the second horizontal plane is different than the first horizontal plane;
and
depositing an electromagnetic shield to coat the plurality of sub-modules, the first openings, and the second openings.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/893,941Filed 5 Jun 2020 · division
Priority: 28 Jun 2018
Published: US 2020/0008327 A124 Sep 2020
Granted: 6 Jul 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 9/0026
Shield cases mounted on a PCB, e.g. cans or caps or conformal shields: integrally formed from metal sheet
H05K 9/0071
Screening of apparatus or components against electric or magnetic fields: active shielding
H05K 9/0037
Of components mounted on printed circuit boards [PCB]: housings with compartments containing a PCB, e.g. partitioning walls
H10W 42/20
Arrangements for protection of devices: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons

Family

Application62/691,440Us provisional application · filed 28 Jun 2018
Application16/390,761Parent of this division · filed 22 Apr 2019
US 2020/0305314 A1Pre-grant publication · published 24 Sep 2020
US 11,219,144 B2Related patent
US 2020/0008327 A1Published application
US 11,058,038 B2This patent

From the US filing history. Foreign family members aren’t listed.