Electric power inverter

An electrical machine comprising an electric power inverter axially or radially arranged thereon, wherein the electric power inverter includes:

• a capacitor board having a plurality of capacitors;
• and
• at least one semiconductor board each having a plurality of power semiconductors;
• wherein the capacitor board and the at least one semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected;
• wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side facing the at least one semiconductor board;
• wherein the plurality of capacitors are arranged on the capacitor board to form at least one open location space between the capacitors, each location space positioned to accommodate one of the at least one semiconductor board;
• wherein each semiconductor board is arranged within the respective location space with a clearance to the capacitor board;
• and
• wherein at least some of the plurality of capacitors are arranged in the middle of the capacitor board and each semiconductor board is arranged on an edge of the capacitor board, so that current paths on the capacitor board extend generally radially from the middle to the edge of the capacitor board.

An electric power inverter comprising:

• a capacitor board having a plurality of capacitors;
• at least one semiconductor board each having a plurality of power semiconductors;
• and
• a thermally-conductive heat exchanger plate made of aluminium and arranged on the at least one semiconductor boar, averted from the capacitor board;
• wherein the capacitor board and the at least one semiconductor board are mutually stacked in a stacking direction, with a clearance, in a stack formation, and are electrically interconnected;
• wherein the plurality of capacitors on the capacitor board are arranged in the stacking direction, and are fitted to a side facing the at least one semiconductor board;
• wherein the plurality of capacitors are arranged on the capacitor board to form at least one open location space between the capacitors, each location space positioned to accommodate one of the at least one semiconductor board;
• wherein each semiconductor board is arranged within the respective location space with a clearance to the capacitor board;
• wherein at least some of the plurality of capacitors are arranged in the middle of the capacitor board and each semiconductor board is arranged on an edge of the capacitor board, so that current paths on the capacitor board extend generally radially from the middle to the edge of the capacitor board;
• wherein each semiconductor board is coupled to the heat exchanger plate in a large-surface thermally-conductive manner;
• and
• the capacitors on the capacitor board are coupled to the heat exchanger plate in a thermally-conductive manner, wherein the heat exchanger plate incorporates capacitor contact sections, which are each coupled to a respective capacitor, radially to the stacking direction.