Modular network switch

A system comprising:

• a device chassis including:
• a first airflow region,
• a second airflow region, and
• a first airflow divider separating the first airflow region and the second airflow region;
• a plurality of removable network switch interface modules housed in the first airflow region of the device chassis, wherein each of the removable network switch interface modules includes a network switch interface module circuit board that is positioned in parallel with other network switch interface module circuit boards of the removable network switch interface modules housed in the device chassis;
• a switch circuit board housed in the first airflow region of the device chassis downstream of the network switch interface module circuit boards, the switch circuit board oriented in an orientation plane perpendicular to orientation planes of the network switch interface module circuit boards, wherein each of the network switch interface module circuit boards is connected to the switch circuit board;
• a switch chip electrically connected to the switch circuit board, housed in the first airflow region of the device chassis downstream of the network switch interface module circuit boards, and configured to switch network traffic between network connections of the plurality of removable network switch interface modules;
• a power bus bar including two ends each adapted to electrically couple to a power component, the two ends being connected by a bridge portion spanning over the switch circuit board, wherein the bridge portion is housed in the first airflow region of the device chassis and is adapted to electrically couple to the removable network switch interface modules, and a first end of the two ends of the power bus bar is housed in the second airflow region of the device chassis;
• a plurality of intake vents for the first airflow region, each of the intake vents corresponding to at least one of the removable network switch interface modules;
• at least one intake vent for the second airflow region that is different than the plurality of intake vents for the first airflow region;
• and
• a thermal component provided over the switch chip housed in the first airflow region of the device chassis.