Receptacle assembly and thermal-transfer assembly

A thermal-transfer assembly comprising:

• a thermal-transfer module configured to be coupled to a device, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion;
• and
• a retention clip configured to directly engage and hold the thermal-transfer module to the device;
• and
• wherein the thermal-transfer module is configured to absorb thermal energy from the device and transfer the thermal energy through the base portion and to the heat-transfer fins, wherein the heat-transfer fins of said plurality have a thickness that is at most 0.40 mm;
• wherein the base portion has an engagement surface that is configured to directly engage the device, wherein each of the heat-transfer fins includes at least one elongated indentation along at least a section of the corresponding heat-transfer fin, the elongated indentations extending lengthwise away from the base portion and being configured to resist deformation of the corresponding heat-transfer fins from a force that is directed toward the base portion.

A thermal-transfer assembly comprising:

• a thermal-transfer module configured to be coupled to a device, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion;
• and
• a retention clip configured to directly engage and hold the thermal-transfer module to the device;
• and
• wherein the thermal-transfer module is configured to absorb thermal energy from the device and transfer the thermal energy through the base portion and to the heat-transfer fins, wherein the heat-transfer fins of said plurality have a thickness that is at most 0.40 mm;
• wherein the heat-transfer fins have corresponding fin heights that extend from the base portion to corresponding distal surfaces, the distal surfaces, for at least a series of the heat-transfer fins of said plurality, being shaped to form depressed segments and elevated segments, the fin height along the elevated segment being greater than the fin height along the depressed segment;
• and
• wherein, for at least the series of the heat-transfer fins, each of the depressed segments includes a folded section that extends toward and interlocks with one or more of the other heat-transfer fins in the series, the folded sections of the depressed segments collectively forming a valley of the thermal-transfer module.