Memory module cooler with vapor chamber device connected to heat pipes
AssigneeHewlett Packard Enterprise Development LP
InventorTravis J. Gaskill
Life of this patent
Estimating the term…
Abstract
An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.
Claims8
A method of manufacturing a memory module cooler, comprising:
- providing a vapor chamber device that bounds a vapor chamber;
- providing a number of heat pipes that include vapor channels;
- connecting the heat pipes to a first wall of the vapor chamber device such that the respective vapor channels of the heat pipes are communicably connected to the vapor chamber via openings in the first wall;
- and
- forming fins that extend from a second wall of the vapor chamber device, the second wall bounding the vapor chamber, the fins and the second wall being part of the same continuous body.
Dependencies are inferred from the claim text.