Method of manufacturing circuit board with embedded conductive circuits
AssigneesAvary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
InventorsXiao-Yan Zhang, Han-Pei Huang
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a circuit board with embedded conductive circuits includes providing a first circuit substrate having a first support board and a first peelable film, providing a second circuit substrate having a second support board and a second peelable film, providing an insulating layer to obtain an intermediate body, pressing the intermediate body, and removing the first support board, the first peelable film, the second support board, and the second peelable film. The first circuit substrate includes a first circuit layer. The second circuit substrate includes a second circuit layer. The first circuit layer is electrically coupled to the second circuit layer through the insulating layer.
Claims12
A method for manufacturing a circuit board with embedded conductive circuits, the method comprising:
- providing a first support board, a first peelable film provided on one surface of the first support board;
- forming a first conductive paste layer on the first peelable film;
- etching the first conductive paste layer to form a first conductive circuit layer;
- forming at least one first conductive pillar on the first conductive circuit layer, the first conductive pillar electrically coupled to the first conductive circuit layer, thereby obtaining a first circuit substrate;
- providing a second support board, one surface of the second support board provided with a second peelable film;
- forming a second conductive paste layer on the second peelable film;
- etching the second conductive paste layer to form a second conductive circuit layer, thereby obtaining a second circuit substrate;
- providing an insulating layer, and sequentially stacking the first circuit substrate, the insulating layer, and the second circuit substrate to obtain an intermediate body;
- pressing the intermediate body so that the first conductive pillar passes through the insulating layer, the first conductive circuit layer and the second conductive circuit layer are electrically coupled through the first conductive pillar, and the first conductive circuit layer and the second conductive circuit layer embedded in the insulating layer;
- and
- removing the first carrier board, the first peelable film, the second carrier board, and the second peelable film, thereby obtaining the circuit board.
A method for manufacturing a circuit board, comprising:
- providing a first circuit substrate, the first circuit substrate comprising a first support board, a first peelable film provided on one surface of the first support board, a first conductive circuit layer on a surface of the first peelable film, and at least one first conductive pillar formed on the first conductive circuit layer, the first conductive pillar electrically coupled to the first conductive circuit layer;
- providing a second circuit substrate, the second circuit substrate comprising a second support board, a second peelable film provided on one surface of the second support board, and a second conductive circuit layer on a surface of the first peelable film;
- providing an insulating layer, and sequentially stacking the first circuit substrate, the insulating layer, and the second circuit substrate to obtain an intermediate body;
- pressing the intermediate body so that the first conductive pillar passes through the insulating layer, the first conductive circuit layer and the second conductive circuit layer are electrically coupled through the first conductive pillar, and the first conductive circuit layer and the second conductive circuit layer are embedded in the insulating layer;
- and
- removing the first carrier board, the first peelable film, the second carrier board, and the second peelable film.
Dependencies are inferred from the claim text.