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US 11,058,009 B2Granted
Component carrier comprising a photo-imageable dielectric and method of manufacturing the same
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorJeesoo Mok
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Abstract
A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.
Claims27
A method of manufacturing a component carrier, comprising:
- forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- patterning a front side of the stack using a first photo-imageable dielectric;
- patterning a back side of the stack;
- providing a metal or metallized core;
- attaching a temporary carrier on a backside of the metal or metallized core;
- forming a first cavity into the metal or metallized core;
- embedding a semiconductor chip and/or a passive component into the first cavity;
- applying the first photo-imageable dielectric on a front side of the metal or metallized core;
- patterning the first photo-imageable dielectric at the first cavity for contacting the embedded semiconductor chip and/or the passive component, thereby forming holes on the front side;
- removing the temporary carrier from the backside of the metal or metallized core;
- applying a dielectric on a backside of the metal or metallized core;
- patterning the dielectric on the backside at the first cavity, thereby forming holes on the back side;
- and
- plating or filling the holes by a metal.
11 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- at least one hole with straight sidewalls on a front side of the stack;
- at least one hole with tapering sidewalls on a back side of the stack;
- a cured patterned first photo-imageable dielectric on the front side of the stack;
- at least one cone-shaped hole on the back side of the stack;
- a metal or metallized core having a first cavity, in which a semiconductor chip and/or a passive component is accommodated;
- and
- a through-hole passing through the metal or metallized core of the component carrier;
- wherein the through-hole extending from the front side has sidewalls being at least partially covered with the cured first photo-imageable dielectric;
- wherein an inner surface of the through-hole is plated or filled by a metal;
- wherein the semiconductor chip or the passive component are mounted on a second photo-imageable dielectric on the back side of the stack or embedded in first photo-imageable dielectric.
8 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- a cured patterned first photo-imageable dielectric on a front side of the stack;
- at least one cone-shaped hole on a back side of the stack;
- a metal or metallized core having a first cavity, in which a semiconductor chip or a passive component is accommodated;
- a through-hole passing through the metal or metallized core of the component carrier;
- wherein the through-hole extends from the front side of the stack and has sidewalls being at least partially covered with the cured first photo-imageable dielectric;
- wherein an inner surface of the through-hole is plated or filled by a metal;
- wherein the semiconductor chip or the passive component is embedded in the at least one electrically insulating layer structure.
5 more elements
Dependencies are inferred from the claim text.