Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions

A method of manufacturing a component carrier being a printed circuit board or an integrated circuit substrate, the method comprising:

• providing a first component carrier portion having a blind opening;
• arranging a component in the blind opening;
• and
• forming a second component carrier portion by at least partially filling the blind opening with a material of the second component carrier portion;
• wherein the second component carrier portion comprises a flexible component carrier material,
• wherein the second component carrier portion comprises a gap filling material covering a sidewall of the blind opening,
• wherein the gap filling material is arranged between the sidewall and the component,
• wherein the second component carrier portion comprises a base layer covering a bottom of the blind opening,
• wherein the component is mounted on the base laver;
• wherein the base layer and the gap filling material are the same material,
• wherein the first component carrier portion forms a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures,
• wherein the component carrier comprises in a direction of main extension two rigid component carrier regions connected via a flexible component carrier region, so that the two rigid component carrier regions are flexibly bendable towards each other,
• wherein the two rigid component carrier regions comprise the first component carrier portion,
• wherein the flexible component carrier region comprises the second component carrier portion;
• and
• wherein the component is flexible, so that the component is bent, when the two rigid component carrier regions are flexibly bent towards each other.

A component carrier being a printed circuit board or an integrated circuit substrate, comprising:

• a first component carrier portion having a blind opening;
• a component arranged in the blind opening;
• and
• a second component carrier portion at least partially filling the blind opening;
• wherein the second component carrier portion comprises a flexible component carrier material,
• wherein the second component carrier portion comprises a gap filling material covering a sidewall of the blind opening,
• wherein the gap filling material is arranged between the sidewall and the component,
• wherein the gap filling material is a cured material,
• wherein the gap filling material comprises polyimide and/or a liquid crystal polymer,
• wherein the second component carrier portion comprises a base layer covering a bottom of the blind opening,
• wherein the component is mounted on the base layer,
• wherein the base layer and the gap filling material are the same material, wherein the first component carrier portion forms a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures,
• wherein the component carrier comprises in a direction of main extension two rigid component carrier regions connected via a flexible component, carrier region, so that the two rigid component carrier regions are flexibly bendable towards each other,
• wherein the two rigid component carrier regions comprise the first component carrier portion,
• wherein the flexible component carrier region comprises the second component carrier portion, and
• wherein the component is flexible, so that the component is bent, when the two rigid component carrier regions are flexibly bent towards each other.