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US 11,058,006 B2Granted
Component-embedded substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorHirokazu Yoshino
Life of this patent
Estimating the term…
Abstract
A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.
Claims9
A component-embedded substrate comprising:
- a buildup layer comprising an insulating resin layer and a conductor layer;
- a cavity that is formed in the buildup layer;
- an electronic component that is mounted on a bottom face of the cavity through an adhesive layer;
- a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component;
- and
- a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal,
- wherein a thickness of the pedestal is larger than a thickness of the adhesive layer, and the thickness of the pedestal is smaller than a depth of the cavity, and
- wherein an entirety of the pedestal is housed within the cavity when the component-embedded substrate is viewed in plan view, and the filling resin covers an entirety of an upper surface of the pedestal, the upper surface of the pedestal being opposite to a lower surface of the pedestal which faces the bottom face of the cavity.
5 more elements
A component-embedded substrate comprising:
- a buildup layer comprising an insulating resin layer and a conductor layer;
- a cavity that is formed in the buildup layer;
- an electronic component that is mounted on a bottom face of the cavity through an adhesive layer;
- a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component;
- and
- a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal,
- wherein:
- the pedestal comprises:
- a first pedestal portion that is opposed to a first corner portion of the electronic component,
- a second pedestal portion that is opposed to a second corner portion of the electronic component,
- a third pedestal portion that is opposed to a third corner portion of the electronic component, and
- a fourth pedestal portion that is opposed to a fourth corner portion of the electronic component;
- and
- each of the first pedestal portion, the second pedestal portion, the third pedestal portion and the fourth pedestal portions is formed into a triangular shape in plan view.
11 more elements
Dependencies are inferred from the claim text.