Electronic component and method for producing an electronic component

A method for producing an electronic component, comprising the steps of:

• providing a circuit carrier;
• providing at least one contact opening which is formed as part of the circuit carrier;
• providing at least one component part;
• providing at least one electrically conductive housing which is part of the at least one component part;
• providing at least one electrical contact element which is insulated from and fed through to the outside of the at least one electrically conductive housing, the at least one electrical contact element being part of the at least one component part;
• providing at least one mechanical or electrical contact-connection point;
• providing at least one seal element is arranged in the region of the contact-connection point, in particular between the circuit carrier and the at least one electrically conductive housing;
• populating the circuit carrier with the at least one component parts;
• connecting the at least one electrical contact element to the at least one contact opening of the circuit carrier at least in a materially bonded manner to form the at least one contact-connection point, such that the at least one component part is arranged at a distance from the circuit carrier.