Metallic layer as carrier for component embedded in cavity of component carrier

A method of manufacturing a component carrier being a printed circuit board, an IC substrate or an organic interposer, the method comprising:

• providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer;
• removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer;
• inserting a component in the cavity;
• placing the component on the metallic layer,
• wherein placing the component on the metallic layer in the cavity is carried out by establishing a direct physical contact between substantially a complete back-side of the component and the metallic layer, and
• wherein inserting the component in the cavity is carried out without adhering the component to the metallic layer;
• carrying out a discharging procedure by charge removal of electric charge carriers;
• and
• at least partially removing the electric charge carriers from the component inserted in the cavity before covering the component in the cavity and before connecting at least one electrically insulating layer structure and/or electrically conductive layer structure to the front side of the base structure.