High-frequency module

A high-frequency module, comprising:

• a substrate, and
• a first electronic component and a second electronic component mounted on a main surface of the substrate,
• wherein the substrate includes a protruding portion projecting from the main surface,
• the first electronic component is mounted on a region of the main surface different from a region in which the protruding portion is provided, and
• the second electronic component is mounted on the protruding portion,
• wherein the protrusion portion includes a plurality of columnar electrodes,
• wherein the plurality of columnar electrodes includes a columnar electrode for signal input/output connected to a signal terminal of the second electronic component, and a columnar electrode for grounding connected to a ground terminal of the second electronic component, and
• when viewed from a thickness direction with respect to the substrate, an interval between the columnar electrode for grounding and a signal terminal of the first electronic component is smaller than an interval between the columnar electrode for signal input/output and the signal terminal of the first electronic component.