Backplane footprint for high speed, high density electrical connectors

A printed circuit board comprising:

• a plurality of layers including conductive layers separated by dielectric layers;
• and
• via patterns formed in the plurality of layers, each of the via patterns comprising:
• first and second signal vias extending from a first surface of the printed circuit board to a breakout layer of the conductive layers;
• and
• ground vias connected to one or more of the conductive layers, wherein the signal vias and the ground vias each include a conductive element having a recess in a surface thereof, wherein each conductive element is configured for solder attachment to a connector lead of a surface mount connector and wherein the recess is configured to be smaller in diameter than the connector lead and is configured to receive only a tip portion of the connector lead.

A printed circuit board comprising:

• a plurality of layers including conductive layers separated by dielectric layers;
• and
• at least one via pattern formed in the plurality of layers, the via pattern comprising:
• first and second signal conductors for attachment of respective first and second signal leads of a component to an upper surface of the printed circuit board and for connection of the first and second signal leads of the component to a breakout layer of the conductive layers;
• and
• at least one ground conductor for attachment to a ground lead of the component and for connection of the ground lead of the component to a ground plane of the conductive layers, wherein each of the first and second signal conductors and the at least one ground conductor has a recess in a surface thereof and wherein the recess is configured to be smaller in diameter than the connector lead and is configured to receive only a tip portion of the connector lead.