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US 11,057,993 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorTae Hong Min
Life of this patent
Estimating the term…
Abstract
A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.
Claims19
A printed circuit board, comprising:
- a first substrate portion;
- and
- a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion,
- wherein the second substrate portion comprises a block member and the flexible insulating layer,
- the flexible insulating layer includes a first insulating layer and a second insulating layer,
- the first insulating layer and the block member are embedded in the second insulating layer,
- the block member has upper and lower surfaces opposing each other and a side surface connecting the upper and lower surfaces,
- a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded, and
- the second insulating layer extends continuously to cover the upper surface, the side surface, and the lower surface of the block member.
6 more elements
Dependencies are inferred from the claim text.