Flexible substrate and a method thereof

A flexible substrate (10) comprising:

• a first flexible layer (20) fabricated with at least one conducting path (30), and configured to sustain an electric power within the conducting path (30);
• a second flexible layer (40) fabricated with a plurality of sensors (50);
• a third flexible layer (60) fabricated in-between the first flexible layer (20) and the second flexible layer (40), and configured to insulate the conducting path (30) of the first flexible layer (20) from some portions of the second flexible layer (40) while being configured to connect the conducting path (30) to one of more of the plurality of sensors upon interaction from a user;
• at least one support structure (70) operatively coupled to the first flexible layer (20), the second flexible layer (40) and the third flexible layer (60), wherein the at least one support structure (70) is configured to:
• receive the signal generated by the second flexible layer;
• and
• provide a support for the first flexible layer, the second flexible layer and the third flexible layer.

A method (200) for fabrication of a flexible substrate, the method comprising:

• fabricating a first flexible layer (210);
• fabricating a conducting path on the first flexible layer (220), the conducting path to sustain an electric power within the conducting path;
• mounting one or more sensors and fabricating a second flexible layer (230);
• fabricating a third flexible layer (240) comprising one or more slots configured to locate the one or more sensors on the second flexible layer and to provide a connectivity to the one or more sensors with the conducting path (30) of the first flexible layer (20);
• mounting the third flexible layer such that it is disposed between the first flexible layer and the second flexible layer (250);
• mounting the second flexible layer on top of the third flexible layer (260);
• and
• fabricating at least one support structure (270).