Printed circuit board and optical transceiver with the printed circuit board

A printed circuit board comprising:

• a dielectric layer;
• a ground conductor layer;
• N pairs of differential signal vias which penetrate through the dielectric layer, wherein N is an integer more than one, and wherein the N pairs of differential signal vias are arranged along one line to penetrate through a same opening in the ground conductor layer;
• N pairs of first strip conductors disposed on a first surface of the dielectric layer;
• N pairs of second strip conductors disposed on a second surface of the dielectric layer;
• and
• ground conductor vias arranged around each of the N pairs of differential signal vias and arranged outside the same opening in the ground conductor layer;
• wherein the N pairs of first strip conductors and the N pairs of second strip conductors are connected to each other via the N pairs of differential signal vias,
• wherein D1 represents a center-to-center distance between two neighboring pairs of differential signal vias of the N pairs of differential signal vias and D1 is smaller than a distance between neighboring ground conductor vias, and
• wherein a center-to-center distance between adjacent differential signal vias, in two neighboring pairs of the N pairs of differential signal vias along the one line, is smaller than a distance between nearest neighboring ground conductor vias of the ground conductor vias.

A printed circuit board comprising:

• a dielectric layer;
• a ground conductor layer;
• N pairs of differential signal vias which penetrate through the dielectric layer,
• wherein N is an integer more than one, and
• wherein for each pair of the N pairs of differential signal vias, the differential signal vias in the pair are arranged along a direction to penetrate through a same opening in a ground conductor layer;
• N pairs of first strip conductors disposed on a first surface of the dielectric layer;
• N pairs of second strip conductors disposed on a second surface of the dielectric layer;
• ground conductor vias arranged around each of the N pairs of differential signal vias and arranged outside the same opening in the ground conductor layer;
• and
• wherein the N pairs of first strip conductors and the N pairs of second strip conductors are connected to each other via the N pairs of differential signal vias, and
• wherein a center-to-center distance between adjacent differential signal vias, in two neighboring pairs of differential signal vias along the direction, is smaller than a distance between nearest neighboring ground conductor vias of the ground conductor vias arranged around each of the N pairs of differential signal vias.