Printed wiring board
AssigneeDENSO TEN Limited
InventorsNobuhisa Katada, Kotaro Hosogi, Yasuyuki Watanabe, Toshiyuki Tanaka
Life of this patent
Estimating the term…
Abstract
A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.
Claims6
A printed wiring board comprising:
- a wiring board body;
- a first connection part that has a higher heat conductivity than a heat conductivity of the wiring board body, and connects the wiring board body and a first element;
- and
- a second connection part that has a higher heat conductivity than the heat conductivity of the wiring board body, and connects the wiring board body and a second element, wherein
- the first connection part includes:
- (i) a heat-receiving front surface that is a first land formed on a front surface of the wiring board body;
- (ii) a heat-receiving back surface formed on a back surface of the wiring board body;
- (iii) a main-heat conducting part that is a through-hole into which a terminal of the first element is inserted, and which inter-connects the heat-receiving front surface and the heat-receiving back surface;
- and (iv) a sub-heat conducting part that inter-connects the heat-receiving front surface and the heat-receiving back surface,
- the second connection part includes a second land that is formed on one of the front and back surfaces of the wiring board body, and is not connected to any conductor pattern formed on an opposite one of the front and back surfaces of the wiring board body,
- the heat-receiving front surface includes:
- (i) a shielded area that is hidden by the first element when the terminal of the first element is connected to the first connection part, and is connected to an end of the main-heat conducting part;
- and (ii) an exposed area that is exposed when the first element is connected to the first connection part, and is connected to an end of the sub-heat conducting part, an area of the exposed area is larger than an area of the shielded area, and
- the first connection part further includes an inner heat conducting part that is formed in an interior of the wiring board body and inter-connects the main-heat conducting part and the sub-heat conducting part, the inner heat conducting part being located between first and second layers of the wiring board body, the first layer located between the heat-receiving front surface and the inner heat conducting part, and the second layer located between the heat-receiving back surface and the inner heat conducting part.
Dependencies are inferred from the claim text.