PCB assembly and method of manufacturing a PCB assembly
AssigneeRohde & Schwarz GmbH & Co. KG
InventorsJosef Köppl, Andreas Geiss, Manuel Spona
Life of this patent
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Abstract
The present invention provides a PCB assembly. The PCB assembly comprises a PCB board element comprising an outer surface, and a micro heat pipe configured for heat transport. The micro heat pipe has a pipe wall and at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner. The thermally conductive connection may comprise a solder connection. Thus, a corresponding micro heat pipe may comprise a pipe wall, wherein at least a section of the pipe wall is configured to be soldered to a PCB element. Furthermore, the present invention provides a corresponding method of manufacturing a PCB assembly.
Claims26
A Printed Circuit Board (PCB) assembly, comprising:
- a PCB board element comprising an outer surface,
- a micro heat pipe configured for heat transport, wherein the micro heat pipe has a pipe wall,
- wherein at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner, and
- wherein the pipe wall is connected to the outer surface along at least 50% of a longitudinal length of the micro heat pipe,
- wherein the micro heat pipe is configured as a longitudinal pipe having a maximum diameter of less than or equal to 4 mm.
A method of manufacturing a PCB assembly, comprising the steps of:
- providing a PCB board element comprising an outer surface;
- providing a micro heat pipe configured for heat transport, wherein the micro heat pipe has a pipe wall;
- and
- connecting at least a section of the pipe wall to the outer surface of the PCB board element in a thermally conductive manner, and
- wherein the pipe wall is connected to the outer surface along at least 50% of a longitudinal length of the micro heat pipe,
- wherein the micro heat pipe is configured as a longitudinal pipe having a maximum diameter of less than or equal to 4 mm.
A micro heat pipe configured for heat transport,
- wherein the micro heat pipe has a pipe wall, and
- wherein at least a section of the pipe wall is configured to be soldered to a PCB element,
- wherein the micro heat pipe comprises a first end and a second end, and
- wherein the pipe wall is configured to be soldered to an outer surface of the PCB element at both of the first and second ends, so that heat can be transported from one part of the PCB element, which is configured as a heat source, to another part of the PCB element, which has a different temperature level or is configured as a heat sink.
A PCB assembly, comprising:
- a PCB board element comprising an outer surface,
- a micro heat pipe configured for heat transport, wherein the micro heat pipe has a pipe wall,
- wherein at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner,
- wherein the micro heat pipe comprises a first end and a second end, and
- wherein the pipe wall is connected to the outer surface at both of the first and second ends, so that heat can be transported from one part of the PCB element, which is configured as a heat source, to another part of the PCB element, which has a different temperature level or is configured as a heat sink,
- wherein the thermally conductive connection of the pipe wall and the outer surface of the PCB board element comprises a solder connection.
A method of manufacturing a PCB assembly, comprising the steps of:
- providing a PCB board element comprising an outer surface;
- providing a micro heat pipe configured for heat transport, wherein the micro heat pipe has a pipe wall;
- and
- connecting at least a section of the pipe wall to the outer surface of the PCB board element in a thermally conductive manner,
- wherein the micro heat pipe comprises a first end and a second end, and
- wherein the pipe wall is connected to the outer surface at both of the first and second ends, so that heat can be transported from one part of the PCB element, which is configured as a heat source, to another part of the PCB element, which has a different temperature level or is configured as a heat sink,
- wherein the thermally conductive connection of the pipe wall and the outer surface of the PCB board element comprises a solder connection.
Dependencies are inferred from the claim text.