Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

A method for manufacturing a flexible printed circuit board, the method comprising:

• providing a first flexible precursor board having at least one circuit layer;
• adhering a first covering layer with a lower opening to the circuit layer, a portion of the circuit layer exposed by the lower opening;
• adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed by the upper opening to obtain a second flexible precursor board;
• providing an upper mold having a protruding portion and a lower mold having a recessed portion, moving the second flexible precursor board between the upper mold and the lower mold, a portion of the second flexible precursor board being positioned between the protruding portion and the recessed portion, a periphery of the second flexible precursor board being positioned away from the protruding portion and the recessed portion, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mold to the lower mold to press the protruding portion into the recessed portion;
• and
• removing the upper mold and the lower mold to obtain the flexible printed circuit board.