Connector, device provided with the same and method of manufacturing the same
AssigneeJapan Aviation Electronics Industry, Limited
InventorKentaro Toda
Life of this patent
Estimating the term…
Abstract
A connector has a main portion formed as a part of a multilayer wiring board and having a tongue shape. The multilayer wiring board is provided with a surface conductive layer and an inner conductive layer. The inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction. The main portion is provided with a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer. Each of the contacts is, at least in part, exposed and contactable in the up-down direction. Since the grounding plate and the contacts are formed in the conductive layers of the multilayer wiring board, the connector can possess desired electric characteristics in high accuracy.
Claims11
A connector which has a main portion formed as a part of a multilayer wiring board and having a tongue shape, wherein:
- the multilayer wiring board comprises a surface conductive layer and an inner conductive layer;
- the inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction;
- the main portion comprises a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer;
- and
- each of the contacts is, at least in part, exposed and contactable in the up-down direction.
A method of manufacturing a connector having a main portion which is formed as a part of a multilayer wiring board and which has a tongue shape, the method comprising:
- preparing the multilayer wiring board;
- forming a grounding plate in a surface conductive layer of the multilayer wiring board in a predetermined section of the multilayer wiring board which is to be the main portion;
- and
- cutting, in the predetermined section, an insulation layer of the multilayer wiring board located forward of the grounding plate in a front-rear direction to expose part of an inner conductive layer of the multilayer wiring board;
- wherein the exposed part of the inner conductive layer forms contacts so that the main portion is formed.
Dependencies are inferred from the claim text.