Resin multilayer substrate, transmission line, module, and method of manufacturing module

#The present invention relates to a resin multilayer substrate that includes a multilayer body including a plurality of insulating-resin base members, a transmission line and a module that include the resin multilayer substrate, and a method of manufacturing the module.

#In the related art, various electronic component modules include resin multilayer substrates each of which includes a plurality of insulating-resin base members laminated together. For example, International Publication No. 2012/074101 discloses a module in which a resin multilayer substrate includes a transmission line having a stripline structure and connectors that are to be connected to an external circuit are mounted on the resin multilayer substrate, so that the module is used as a cable.

#In the module disclosed in International Publication No. 2012/074101, a protective layer is formed on a surface of the resin multilayer substrate such that electrodes for mounting the connectors are exposed on the surface, and the connectors are joined to the electrodes.

#FIG. 1 is a perspective view of a module according to a first preferred embodiment of the present invention.

#FIG. 2A is a sectional view of the module. FIG. 2B is a plan view of the module according to the first preferred embodiment of the present invention. FIG. 2C is a plan view illustrating a first region and second regions of the module according to the first preferred embodiment of the present invention.

#FIG. 3A is a sectional view of a resin multilayer substrate of the module according to the first preferred embodiment of the present invention before connectors are mounted on the resin multilayer substrate, and FIG. 3B is a plan view of the resin multilayer substrate illustrated in FIG. 3A.

#A plurality of preferred embodiments of the present invention will be described below using some specific examples with reference to the drawings. The same or similar members and elements illustrated in the drawings are denoted by the same reference signs. Although the preferred embodiments will be separately described for ease of explaining or understanding the gist of the present invention, the configurations according to the different preferred embodiments may be partially replaced with each other or may be combined with each other. In a second preferred embodiment, descriptions of matters that are common to a first preferred embodiment will be omitted, and only differences will be described. In particular, similar advantageous effects obtained with similar configurations will not be described in every preferred embodiment.

#FIG. 1 is a perspective view of a module 121 according to a first preferred embodiment of the present invention. The module 121 is used as a connector-equipped high-frequency cable. For example, the module 121 is preferably connected between an antenna and a high-frequency circuit in an electronic device, such as a smartphone.

#The module 121 includes a multilayer body 10 including a plurality of insulating-resin base members, protective films 21 and 22 provided on surfaces of the multilayer body 10, and connectors 91 and 92 mounted on the multilayer body 10. The multilayer body 10 includes thin-layer portions TP1 and TP2 that are located in the vicinity of portions on which the connectors 91 and 92 are mounted.