Antenna-in-package system and mobile terminal

An antenna-in-package system, applied to a mobile terminal comprising a main board, the antenna-in-package system comprising:

• a substrate;
• a metal antenna provided on a side of the substrate facing away from the main board;
• an integrated circuit chip provided on a side of the substrate close to the main board;
• and
• a circuit provided in the substrate and connected to the main board, the circuit connecting the metal antenna with the integrated circuit chip,
• wherein the metal antenna is a patch antenna simultaneously fed with power by two feeding points, and the two feeding points are configured to excite electromagnetic waves in different bands;
• the two feeding points comprise a first feeding point and a second feeding point, the first feeding point is configured to excite electromagnetic waves in a band of 28 GHz, and the second feeding point is configured to excite electromagnetic waves in a band of 39 GHz;
• the antenna-in-package system is formed by being laminated by a LTCC process, and the size of the antenna-in-package system is 18×5 mm.