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US 11,056,765 B2Granted
Microelectronic devices designed with foldable flexible substrates for high frequency communication modules
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Georgios C. Dogiamis, Sasha N. Oster
Life of this patent
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Abstract
Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
Claims17
A microelectronic device comprising:
- a first substrate having radio frequency (RF) circuits;
- and
- a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section being foldable at a location in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is foldable than at a location beneath the first substrate.
A microelectronic device comprising:
- a first substrate having radio frequency (RF) circuits;
- and
- a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section folded at a location to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is folded than at a location beneath the first substrate.
A computing device comprising:
- at least one processor to process data;
- and
- a communication module or chip coupled to the at least one processor, the communication module or chip comprises, a first substrate having radio frequency (RF) circuits, a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section being folded at a location in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 15 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is folded than at a location beneath the first substrate.
Dependencies are inferred from the claim text.