Oscillator, method of manufacturing oscillator, electronic apparatus, and vehicle
AssigneeSeiko Epson Corporation
InventorNorio Nomura
Life of this patent
Estimating the term…
Abstract
An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.
Claims11
An oscillator comprising:
- a substrate having a first substrate body main surface, a substrate body side surface provided with a cutout portion, and a second substrate body main surface;
- a lid body bonded to the substrate and including a metal material,
- a side surface wiring provided along the cutout portion;
- a filling member provided in the cutout portion;
- and
- an insulating coating member provided on the first substrate body main surface so as to cover the entirety of the first substrate body main surface,
- wherein the filling member extends in the cutout portion from the first substrate body main surface to the second substrate main body surface, and
- wherein the insulating coating member covers a top surface of the filling member that is level with the first substrate body main surface and covers an upper end of the side surface wiring that is placed on the first substrate body main surface and extends from the cutoff portion.
A method of manufacturing an oscillator, comprising:
- preparing a substrate body having a first substrate body main surface, a substrate body side surface provided with a cutout portion, and a second substrate body main surface;
- forming a side surface wiring along the cutout portion;
- providing a filling member in the cutout portion so that the filling member extends in the cutout portion from the first substrate body main surface to the second substrate body main surface;
- preparing an insulating coating member on the first substrate body main surface so as to cover the entirety of the first substrate body main surface, the insulating coating member covering a top surface of the filling member that is level with the first substrate body main surface and covering an upper end of the side surface wiring that is placed on the first substrate body main surface and extends from the cutoff portion;
- and
- mounting a lid body on the insulating coating member.
Dependencies are inferred from the claim text.