Electronic component housing package, electronic device, and electronic module

An electronic component housing package, the package comprising:

• a base section that comprises a mounting section for an electronic component;
• a projecting part that is positioned on the base section and projects from the base section;
• a frame part that is positioned on the base section and surrounds the mounting section;
• a frame-shaped metalized layer that is positioned on the frame part;
• a plurality of external connection conductors that is positioned opposite the mounting section in a thickness direction;
• a connection conductor which is positioned on the projecting part and for connecting to the electronic component via a joining material;
• and
• a wiring conductor that is connected to the connection conductor and that is led out to the base section, wherein
• the connection conductor comprises an inclined part that is inclined toward the wiring conductor in a lower portion of the connection conductor, and
• a thickness of the connection conductor gradually increases toward the wiring conductor.