Method of manufacturing package and method of manufacturing light-emitting device
AssigneeNichia Corporation
InventorTakayuki Mitsunaga
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a package includes providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead. The method further includes disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed, and applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion. The method also includes removing the molded resin from the mold, the molded resin being applied with the ink.
Claims18
A method of manufacturing a package, the method comprising:
- providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;
- disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed;
- applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion;
- and
- removing the molded resin from the mold, the molded resin being applied with the ink.
A method of manufacturing a package, the method comprising:
- providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;
- supplying an ink into a cavity of a mold, the ink having a darker color than an inner surface of the depressed portion;
- applying the ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by disposing the molded resin in the cavity in which the ink is supplied, in a state where the depressed portion of the molded resin is closed;
- and
- removing the molded resin from the mold, the molded resin being applied with the ink.
A method of manufacturing a light-emitting device, the method comprising:
- providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;
- mounting the light-emitting element on the depressed portion;
- supplying an encapsulant into the depressed portion to cover the light-emitting element;
- disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed;
- applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion;
- and
- removing the molded resin from the mold, the molded resin being applied with the ink.
A method of manufacturing a light-emitting device, the method comprising:
- providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;
- mounting the light-emitting element on the depressed portion;
- supplying an encapsulant into the depressed portion to cover the light-emitting element;
- supplying an ink into a cavity of a mold, the ink having a darker color than an inner surface of the depressed portion;
- applying the ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by disposing the molded resin in the cavity in which the ink is supplied, in a state where the depressed portion of the molded resin is closed;
- and
- removing the molded resin from the mold, the molded resin being applied with the ink.
Dependencies are inferred from the claim text.