Complex sensing device packaging structure and packaging method
AssigneeSensortek Technology Corp.
InventorsWen-Chieh Tsou, Yi-Hua Chang, Chih-Wei Chen
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Abstract
A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.
Claims11
A complex sensing device packaging structure, comprising:
- a light emitting element sealed in a first transparent molding material;
- a light sensing element sealed in a second transparent molding material;
- a substrate disposed with the light emitting element, the light sensing element, the first transparent molding material and the second transparent molding material;
- and
- an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature;
- wherein a solidification temperature of the opaque blocking element is lower than a glass transition temperature of the first transparent molding material and the second transparent molding material.
A complex sensing device packaging method, comprising:
- disposing a light emitting element and a light sensing element on a substrate;
- sealing the light emitting element in a first transparent molding material, and sealing the light sensing element in a second transparent molding material;
- forming a molding space between the first transparent molding material and the second transparent molding material;
- and
- dropping a liquid opaque glue into the molding space to form a blocking element by performing a solidifying process to the liquid opaque glue;
- wherein a solidification temperature of the liquid opaque glue is lower than a glass transition temperature of the first transparent molding material and the second transparent molding material.
Dependencies are inferred from the claim text.