Semiconductor device
AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorsHai Yang Zhang, Zhuo Fan Chen
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AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorsHai Yang Zhang, Zhuo Fan Chen
Estimating the term…
Semiconductor devices and fabrication methods are provided. A semiconductor device includes a substrate, a source and drain material layer formed on the substrate. The source and drain material layer contains a first trench there-through. The semiconductor device further includes a mask layer formed on the source and drain material layer containing a second trench there-through. The second trench has a cross-section area larger than the first trench and covers the first trench. The semiconductor device further includes a channel material layer conformally formed on a bottom and sidewalls of each of the first trench and the second trench and a gate structure conformally formed on the channel material layer, on the bottom and the sidewalls of each of the first trench and the second trench. The gate structure has a recess and the recess has a symmetrical step structure.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.