Method of forming shaped source/drain epitaxial layers of a semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Jing Lee, Ming-Hua Yu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Jing Lee, Ming-Hua Yu
Estimating the term…
In a method for manufacturing a semiconductor device, an isolation insulating layer is formed over a fin structure. A first portion of the fin structure is exposed from and a second portion of the fin structure is embedded in the isolation insulating layer. A dielectric layer is formed over sidewalls of the first portion of the fin structure. The first portion of the fin structure and a part of the second portion of the fin structure in a source/drain region are removed, thereby forming a trench. A source/drain epitaxial structure is formed in the trench using one of a first process or a second process. The first process comprises an enhanced epitaxial growth process having an enhanced growth rate for a preferred crystallographic facet, and the second process comprises using a modified etch process to reduce a width of the source/drain epitaxial structure.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.