Nanosheet transistor with dual inner airgap spacers
AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Kangguo Cheng, Chun-Chen Yeh, Tenko Yamashita
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AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Kangguo Cheng, Chun-Chen Yeh, Tenko Yamashita
Estimating the term…
A substrate structure includes a set of nanosheet layers stacked upon a substrate. The substrate structure includes a p-channel region and an n-channel region. The substrate structure further includes divots within the p-channel region and the n-channel region. A first liner is formed within the divots of the n-channel region. The first liner is formed of a material having a positive charge. A second liner is formed within the divots of the p-channel region. The second liner is formed of a material having a negative charge. A p-type epitaxy is deposited in the p-channel region to form first air gap spacers of the divots in the p-channel region. An n-type epitaxy is deposited in the n-channel region to form second air gap spacers of the divots in the n-channel region.
A method of fabricating a nanosheet transistor comprising:
A computer usable program product comprising one or more computer-readable storage devices, and program instructions stored on at least one of the one or more storage devices, the stored program instructions comprising:
Dependencies are inferred from the claim text.