Silicon carbide semiconductor device

A silicon carbide semiconductor device comprising:

• a semiconductor substrate of silicon carbide;
• a semiconductor layer having a first conductivity type and disposed on the semiconductor substrate;
• a first impurity region having a second conductivity type and selectively disposed in an upper layer of the semiconductor layer;
• a second impurity region having the first conductivity type and selectively disposed in an upper layer of the first impurity region;
• a gate insulating film provided to be continuously in contact with the second impurity region, the first impurity region, and the semiconductor layer;
• a gate electrode disposed in a position facing the second impurity region, the first impurity region, and the semiconductor layer via at least the gate insulating film;
• a third impurity region having the second conductivity type, the third impurity region being disposed in the upper layer of the semiconductor layer in an outer peripheral region that is an outer periphery of a cell arrangement region in which a unit cell including the first and second impurity regions is disposed;
• a field insulating film that is disposed on the semiconductor layer in the outer peripheral region, and is thicker than the gate insulating film;
• an interlayer insulating film disposed on the field insulating film, the gate electrode, and the gate insulating film;
• a first main electrode disposed on the interlayer insulating film;
• a second main electrode disposed across the semiconductor substrate from the semiconductor layer;
• and
• a gate wire and a gate pad electrically connected to each other,
• wherein the third impurity region comprises a fourth impurity region having the second conductivity type, selectively disposed in an upper layer of the third impurity region, and having a higher impurity concentration than the third impurity region,
• the fourth impurity region is provided to surround at least a region below the gate pad, and is electrically connected to the first main electrode, and
• the fourth impurity region entirely surrounds the gate pad in plan view, and is electrically connected to the first main electrode via a plurality of well contact holes extending through the interlayer insulating film and the field insulating film to the fourth impurity region.