Semiconductor photomultiplier
AssigneeSensL Technologies Ltd.
InventorsBrian McGarvey, Stephen John Bellis, John Carlton Jackson
Life of this patent
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Abstract
The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.
Claims17
A semiconductor photomultiplier comprising:
- a semiconductor substrate;
- an array of microcells on an upper surface of the semiconductor substrate, wherein each microcell comprises a photosensitive element;
- a plurality of minor bus lines on the upper surface of the semiconductor substrate and extending vertically along columns of the microcells, wherein each minor bus line couples the microcells of a respective column together;
- a plurality of vias extending through the semiconductor substrate coupled to corresponding ones of the plurality of minor bus lines and coupling the plurality of minor bus lines to a bottom surface of the semiconductor substrate;
- and
- a major bus line provided on the bottom surface of the semiconductor substrate comprising a plurality of segments, wherein each segment is coupled to a corresponding one of the plurality of vias, and all of the segments are coupled to a terminal of the semiconductor photomultiplier,
- wherein the array of microcells, the plurality of minor bus lines, the plurality of vias, and the major bus line are fabricated on the semiconductor substrate using semiconductor processing techniques.
A semiconductor photomultiplier comprising:
- a semiconductor substrate;
- an array of microcells on an upper surface of the semiconductor substrate, wherein each microcell comprises a photosensitive element;
- a first plurality of minor bus lines on the upper surface of the semiconductor substrate and extending vertically along columns of the microcells, wherein each of the first plurality of minor bus lines couples the microcells of a respective column together;
- a first major bus line on the upper surface and extending horizontally adjacent a first outer row of the microcells and coupling to each of the first plurality of minor bus lines on the upper surface;
- a first plurality of vias extending through the semiconductor substrate coupled to the first major bus line and coupling the first major bus line on the upper surface to a bottom surface of the semiconductor substrate;
- and
- a second major bus line formed on the bottom surface of the semiconductor substrate coupled to the first plurality of vias and comprising a plurality of segments providing corresponding track lengths that equalize signal delays from the microcells to a first terminal of the semiconductor photomultiplier,
- wherein the array of microcells, the first plurality of minor bus lines, the first major bus line, the first plurality of vias, and the second major bus line are fabricated on the semiconductor substrate using semiconductor processing techniques.
Dependencies are inferred from the claim text.