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US 11,056,479 B2Granted
Chip, manufacturing method, and mobile terminal
AssigneeGuangdong Oppo Mobile Telecommunications Corp., Ltd.
InventorJian Bai
Life of this patent
Estimating the term…
Abstract
In a chip, a manufacturing method, and a mobile terminal, the chip includes a first region and a second region. The first region is formed by at least one first circuit unit set. The second region is formed by a second circuit unit set. The at least one first circuit unit set includes a plurality of identical circuit units. A number of circuit units in the first region determines a specification of the chip and a size of the first region of the chip.
Claims8
A method for manufacturing a plurality of chips, comprising:
- dividing a chip substrate into a plurality of chip regions;
- processing a first region of each of the chip regions for forming at least one first circuit unit set;
- processing a second region of each of the chip regions for forming a second circuit unit set, and cutting the chip substrate into the plurality of chip regions for forming the plurality of chips, wherein the at least one first circuit unit set in the first region of each chip comprises a plurality of same circuit units, a size of the first region of each chip is determined by a number of the same circuit units in the first region of the corresponding chip, and the number of the same circuit units in the first region of each chip determines a specification of the chip, wherein the specification of the chip comprises an operational frequency of the corresponding chip, the plurality of chips comprise a first chip and a second chip, and the operational frequency of the specification of the first chip is higher than the operational frequency of the specification of the second chip.
Dependencies are inferred from the claim text.