US 11,056,476 B2 · Microcontroller unit and fabrication method thereof

Abstract

The present disclosure provides a microcontroller unit and its fabrication method. The microcontroller unit includes a logic control substrate, and also includes at least one memory die and at least one non-memory die, which are disposed on the logic control substrate. The logic control substrate includes a semiconductor device layer and an interconnection dielectric layer. A central processing unit and at least one logic controller are formed in the semiconductor device layer. All memory dies are disposed on the interconnection dielectric layer side by side or stacked one over another, and the at least one memory die is electrically connected to the central processing unit through a corresponding electrical interconnection structure in the interconnection dielectric layer. All non-memory dies are disposed on the interconnection dielectric layer side by side or stacked one over another and are electrically connected to corresponding logic controllers through corresponding electrical interconnection structures in the interconnection dielectric layer.

Claims20

Dependent claims

A microcontroller unit, comprising:

a logic control substrate, including a semiconductor device layer and an interconnection dielectric layer formed on the semiconductor device layer, wherein:
a central processing unit and at least one logic controller are formed in the semiconductor device layer, and electrical interconnection structures are formed in the interconnection dielectric layer for respectively leading out the central processing unit and the at least one logic controller;
and
at least one memory die and at least one non-memory die having a non-storage function, wherein:
all of the at least one memory die are disposed on the interconnection dielectric layer side by side or stacked one over another, and the at least one memory die is connected to a corresponding electrical interconnection structure in the interconnection dielectric layer to electrically connect to the central processing unit;
and
all of the at least one non-memory die are disposed on the interconnection dielectric layer side by side or stacked one over another, and are electrically connected to corresponding electrical interconnection structures in the interconnection dielectric layer to electrically connect to corresponding logic controllers.

4 more elements

A method for fabricating a microcontroller unit, comprising:

providing a logic control substrate, wherein the logic control substrate includes a semiconductor device layer and an interconnection dielectric layer stacked sequentially from bottom to top;
forming a central processing unit and at least one logic controller in the semiconductor device layer;
and forming electrical interconnection structures in the interconnection dielectric layer for respectively leading out the central processing unit and the at least one logic controller;
providing at least one memory die and at least one non-memory die having a non-storage function;
disposing all of the at least one memory die on the interconnection dielectric layer side by side or stacked one over another;
and disposing all of the at least non-memory die on the interconnection dielectric layer side by side or stacked one over another;
and
forming electrical connection structures, wherein the at least one memory die and the least one non-memory die are electrically connected to corresponding electrical interconnection structures respectively, such that the at least one memory die is electrically connected to the central processing unit, and the at least one non-memory die is electrically connected to the corresponding at least one logic controller.

5 more elements

Dependencies are inferred from the claim text.

Microcontroller unit and fabrication method thereof

Life of this patent

Microcontroller unit and fabrication method thereof

Life of this patent

Abstract

Claims20