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US 11,056,475 B2Granted
Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorKatsumi Taniguchi
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes: a first circuit substrate having a conductive layer disposed on an insulating plate; a plurality of semiconductor elements on the conductive layer, a second circuit substrate disposed above the semiconductor elements, the second circuit substrate having a main current wiring layer and a control wiring layer positioned in a layer above the main current wiring layer; a first lead terminal vertically extending upwards from and in contact with the main current wiring layer; a second lead terminal vertically extending upwards from and in contact with the conductive layer of the first circuit substrate; a third lead terminal vertically extending upwards from and in contact with the control wiring layer; and a sealing material covering at least some of the elements mentioned above.
Claims20
A semiconductor module, comprising:
- a first circuit substrate having an insulating plate and a conductive layer disposed on the insulating plate;
- a plurality of semiconductor elements on the conductive layer, the semiconductor elements each having a control electrode and a first main electrode on an upper surface thereof and a second main electrode on a bottom surface thereof, the second main electrode being in contact with and electrically connected to the conductive layer;
- a second circuit substrate disposed above the semiconductor elements, the second circuit substrate having an insulating layer, a main current wiring layer embedded in the insulating layer, and a control wiring layer embedded in the insulating layer, the control wiring layer being positioned in a layer above the main current wiring layer;
- main current pins connecting each of the first main electrodes and the main current wiring layer;
- control pins connecting each of the control electrodes and the control wiring layer;
- a first lead terminal vertically extending upwards from and in contact with the main current wiring layer of the second circuit substrate;
- a second lead terminal vertically extending upwards from and in contact with the conductive layer of the first circuit substrate;
- a third lead terminal vertically extending upwards from and in contact with the control wiring layer of the second circuit substrate;
- and
- a sealing material covering at least an upper surface of the first circuit substrate, side surfaces and the upper surfaces of the semiconductor elements, and a lower surface of the second circuit substrate,
- wherein in a plan view, the first lead terminal and the third lead terminal are positioned above the conductive layer connected to the second main electrodes.
8 more elements
A semiconductor module, comprising:
- a first circuit substrate having an insulating plate and a conductive layer disposed on the insulating plate;
- a plurality of semiconductor elements on the conductive layer, the semiconductor elements each having a control electrode and a first main electrode on an upper surface thereof and a second main electrode on a bottom surface thereof, the second main electrode being in contact with and electrically connected to the conductive layer;
- a second circuit substrate disposed above the semiconductor elements, the second circuit substrate having an insulating layer, a main current wiring layer embedded in the insulating layer, and a control wiring layer embedded in the insulating layer, the control wiring layer being positioned in a layer above the main current wiring layer;
- main current pins connecting each of the first main electrodes and the main current wiring layer;
- control pins connecting each of the control electrodes and the control wiring layer;
- a first lead terminal vertically extending upwards from and in contact with the main current wiring layer of the second circuit substrate;
- a second lead terminal vertically extending upwards from and in contact with the conductive layer of the first circuit substrate;
- a third lead terminal vertically extending upwards from and in contact with the control wiring layer of the second circuit substrate;
- a sealing material covering at least an upper surface of the first circuit substrate, side surfaces and the upper surfaces of the semiconductor elements, and a lower surface of the second circuit substrate;
- and
- a resistor element disposed on an upper surface of the insulating layer of the second circuit substrate, the resistor element being inserted in a current path in the control wiring layer to the third lead terminal,
- wherein the control wiring layer includes:
- a first wiring part for wiring the plurality of control pins and the resistor element such that the plurality of control pins are wired at equal lengths;
- and
- a second wiring part for wiring the resistor element and the third lead terminal.
12 more elements
A semiconductor module, comprising:
- a first circuit substrate having an insulating plate and a conductive layer disposed on the insulating plate;
- a plurality of semiconductor elements on the conductive layer, the semiconductor elements each having a control electrode and a first main electrode on an upper surface thereof and a second main electrode on a bottom surface thereof, the second main electrode being in contact with and electrically connected to the conductive layer;
- a second circuit substrate disposed above the semiconductor elements, the second circuit substrate having an insulating layer, a main current wiring layer embedded in the insulating layer, and a control wiring layer embedded in the insulating layer, the control wiring layer being positioned in a layer above the main current wiring layer;
- main current pins connecting each of the first main electrodes and the main current wiring layer;
- control pins connecting each of the control electrodes and the control wiring layer;
- a first lead terminal vertically extending upwards from and in contact with the main current wiring layer of the second circuit substrate;
- a second lead terminal vertically extending upwards from and in contact with the conductive layer of the first circuit substrate;
- a third lead terminal vertically extending upwards from and in contact with the control wiring layer of the second circuit substrate;
- and
- a sealing material covering at least an upper surface of the first circuit substrate, side surfaces and the upper surfaces of the semiconductor elements, and a lower surface of the second circuit substrate,
- wherein the second circuit substrate further includes a sense wiring layer embedded in the insulating layer between the main current wiring layer and the control wiring layer and connected to at least some of the first main electrodes of the semiconductor elements.
8 more elements
Dependencies are inferred from the claim text.