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US 11,056,474 B2Granted
Semiconductor package, semiconductor device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng
Life of this patent
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Abstract
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body.
Claims20
A method comprising:
- forming a semiconductor package comprising:
- providing a temporary bonding layer over a carrier;
- providing a chip and a passive component over the temporary bonding layer;
- providing a mask layer having a recess formed therein between the chip and the passive component, the mask layer being disposed in a same vertical level as the chip and the passive component, the mask layer being a conformal layer;
- providing a molding compound in the recess of the mask layer, a thickness of the molding compound being equal to a height of the recess, top surfaces of the mask layer, the molding compound, the chip, and the passive component being at a same level;
- providing a redistribution layer over and connected to the chip and the passive component;
- providing a plurality of metal bumps connected to the chip and the passive component by the redistribution layer;
- after providing the plurality of metal bumps, debonding the semiconductor package from the carrier;
- and
- providing the semiconductor package over and connected to a printed circuit board.
7 more elements
A method comprising:
- attaching a chip and a passive component over a carrier, the chip having a first sidewall, the passive component having a second sidewall;
- forming a mask layer extending along the first sidewall, along a portion of a surface between the chip and the passive component, and along the second sidewall, the mask layer defining a recess, the mask layer being a conformal layer;
- forming a molding compound over the mask layer, the molding compound filling the recess, wherein a topmost surface of the chip is level with a topmost surface of the passive component, a topmost surface of the mask layer, and a topmost surface of the molding compound, and wherein the topmost surface of the mask layer is level with the topmost surface of the molding compound between the chip and the passive component;
- and
- forming a redistribution structure over the chip, the passive component, and the carrier, the redistribution structure comprising one or more conductive layers that are connected to the chip and the passive component, the mask layer and the molding compound contacting the redistribution structure between the chip and the passive component.
2 more elements
A method comprising:
- disposing backsides of a chip and a passive component on a surface, input/output connectors of the chip facing away from the surface, the chip comprising active devices and the passive component comprising passive devices and being free of active devices;
- forming a mask layer having a recess formed therein, the mask layer being disposed between the chip and the passive component, and the chip, the passive component, and the mask layer being disposed at a same vertical level, the mask layer being a conformal layer contacting sidewalls of the chip and the passive component and the surface between the chip and the passive component;
- and
- forming a molding compound disposed in the recess and having a thickness equal to a height of the recess, top surfaces of the molding compound and the mask layer being at a same level;
- forming a redistribution structure on the chip and the passive component and over the surface, the redistribution structure comprising one or more conductive layers that are connected to the chip and the passive component, the mask layer and the molding compound contacting the redistribution structure between the chip and the passive component;
- forming a plurality of metal bumps on the redistribution structure, the redistribution structure being electrically coupled to the chip and the passive component;
- bonding the plurality of metal bumps to a substrate;
- and
- forming an underfill layer disposed between the substrate and the redistribution structure, the underfill layer surrounding the plurality of metal bumps.
6 more elements
Dependencies are inferred from the claim text.