Packages with metal line crack prevention design
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen
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Abstract
A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.
Claims21
A package comprising:
- a first package comprising:
- a device die comprising a topmost surface at a first vertical level and a bottommost surface at a second vertical level;
- a through-via extending from the first vertical level to the second vertical level;
- an encapsulant encapsulating the device die and the through-via therein;
- a plurality of redistribution lines over the device die;
- and
- a plurality of metal pads over and electrically coupling to the plurality of redistribution lines, wherein the plurality of metal pads comprise:
- an array comprising a plurality of rows and a plurality of columns of metal pads, wherein each of metal pads in the array comprises a rounded portion and a bird-beak portion joining the rounded portion, wherein the array comprises a corner metal pad closest to a corner of the first package, wherein the corner metal pad is electrically connected to the through-via, and wherein the corner metal pad is a center-facing pad with a bird-beak pointing direction pointing from a center of the rounded portion of the corner metal pad to a tip of the bird-beak portion of the corner metal pad being substantially pointing to a center of the first package, and wherein bird-beak pointing directions of all metal pads in the array are parallel to each other;
- and
- an under-metal-metallurgy (UBM) contacting the rounded portion of the corner metal pad.
A package comprising:
- a device die comprising a center;
- an encapsulating material encapsulating the device die therein;
- and
- a plurality of metal pads in a same layer underlying the device die, with some of the plurality of metal pads electrically coupling to the device die, wherein the plurality of metal pads comprise:
- a corner pad, wherein the corner pad is overlapped by the device die, and is closer to a corner of the device die than all other metal pads overlapped by the device die, wherein in a plane view of the package, a bird-beak direction of the corner pad points to the center of the device die.
A package comprising:
- a first device die;
- and
- a plurality of metal pads underlying the first device die, wherein the plurality of metal pads comprise:
- a first array of metal pads comprising a first plurality of rows and a first plurality of columns of metal pads, wherein each of the first array of metal pads comprises a first rounded portion and a first bird-beak portion joining the first rounded portion, with bird-beaks of the first array of metal pads all pointing to a same direction, wherein the first array of metal pads comprises a first corner metal pad at a first corner of the package;
- and
- a second corner metal pad at a second corner of the package, wherein the second corner metal pad comprises a second rounded portion and a second bird-beak portion joining the second rounded portion, wherein the first bird-beak portion and the second bird-beak portion point to each other.
Dependencies are inferred from the claim text.