Locking dual leadframe for flip chip on leadframe packages

An integrated circuit package comprising:

• a locking dual lead frame including:
• a first metal frame including a plurality of leads;
• and
• a second metal frame attached to the first metal frame, the second metal frame including a plurality of planar levels connected by a plurality of portions that are at an angle with respect to the plurality of planar levels, one of the plurality of planar levels including a die pad;
• a die on the die pad, the die in between the first metal frame and the second metal frame;
• under fill material between portions of the die and the first metal frame;
• and
• mold compound covering portions of the die, the under fill material, and the locking dual lead frame.

An integrated circuit package comprising:

• a locking dual lead frame including:
• a first metal frame;
• and
• a second metal frame attached to the first metal frame, the second metal frame including a plurality of planar levels, one of the plurality of planar levels including a die pad;
• a die on the die pad, the die in between the first metal frame and the second metal frame;
• under fill material between portions of the die and the first metal frame;
• and
• mold compound covering portions of the die, the under fill material, and the locking dual lead frame, wherein the plurality of planar levels is within the mold compound.