Chip package structure and method for forming the same

A method for forming a chip package structure, comprising:

• partially removing a carrier substrate to form an alignment trench in the carrier substrate, wherein the alignment trench surrounds a bonding portion of the carrier substrate, and a trench width of the alignment trench is less than a first width of the bonding portion;
• forming a liquid layer over the bonding portion;
• disposing a chip structure over the liquid layer, wherein the chip structure and the bonding portion have a same shape;
• and
• evaporating the liquid layer, wherein the chip structure is bonded to the bonding portion after the liquid layer is evaporated.

A method for forming a chip package structure, comprising:

• partially removing a first redistribution layer to form an alignment trench in the first redistribution layer, wherein the alignment trench surrounds a bonding portion of the first redistribution layer;
• forming a liquid layer over the bonding portion;
• disposing a chip structure over the liquid layer, wherein the chip structure comprises a semiconductor substrate;
• and
• evaporating the liquid layer, wherein the chip structure is bonded to the bonding portion, and an inner wall of the alignment trench and a sidewall of the semiconductor substrate are substantially level with each other after the liquid layer is evaporated.