Semiconductor device with bond wire reinforcement structure
AssigneeNXP USA, Inc.
InventorsBoon Yew Low, Lan Chu Tan, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong
Life of this patent
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Abstract
A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.
Claims15
A packaged semiconductor device, comprising:
- a substrate having a plurality of input/output (I/O) pads;
- a semiconductor die having a top, active surface, and a bottom, passive surface, wherein the bottom surface of the die is attached to a top surface of the substrate;
- a plurality of bond wires electrically connecting die bonding pads on the die active surface to respective ones of the substrate I/O pads;
- a fibrous bond-wire reinforcement structure formed over the bond wires and in contact with the bond wires;
- and
- a molding compound formed over the bond wires, the fibrous bond-wire reinforcement structure, the top surface of the die, and the top surface of the substrate;
- wherein the fibrous bond-wire reinforcement structure comprises a woven mat formed with a non-electrically conductive material.
A packaged semiconductor device, comprising:
- a substrate having a plurality of input/output (I/O) pads;
- a semiconductor die having a top, active surface, and a bottom, passive surface, wherein the bottom surface of the die is attached to a top surface of the substrate;
- a plurality of bond wires electrically connecting die bonding pads on the die active surface to respective ones of the substrate I/O pads;
- a fibrous bond-wire reinforcement structure formed over the bond wires and in contact with the bond wires;
- and
- a molding compound formed over the bond wires, the fibrous bond-wire reinforcement structure, the top surface of the die, and the top surface of the substrate;
- wherein the wherein the fibrous bond-wire reinforcement structure comprises cellulose nanofibers.
Dependencies are inferred from the claim text.