Negative fillet for mounting an integrated device die to a carrier
AssigneeAnalog Devices, Inc.
InventorsVikram Venkatadri, David Frank Bolognia
Life of this patent
Estimating the term…
Abstract
In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.
Claims20
An electronic module comprising:
- a package substrate disposed on a stiffener;
- an integrated device die having an upper side, a lower side, and an outer side edge, the lower side comprising a first portion and a recess at or near the outer side edge, wherein the integrated device die is at least as wide as the stiffener laterally;
- and
- a mounting compound comprising a first portion disposed between the first portion of the integrated device die and the package substrate and a second portion disposed along at least a portion of the recess of the integrated device die, the mounting compound laterally inset relative to the outer side edge of the integrated device die.
An electronic module comprising:
- a package substrate having a mounting portion and a bent portion that is bent relative to the mounting portion about a support structure;
- an integrated device die having an upper surface, a lower surface, and an outer side edge, the lower surface comprising a mounting surface and a groove being inset from the outer side edge, the bent portion of the package substrate being inset from the outer side edge;
- and
- a mounting compound disposed between the mounting surface of the integrated device die and the mounting portion of the package substrate, the mounting compound being laterally inset from the outer side edge.
An electronic module comprising:
- means for mounting an integrated device die on a package substrate disposed on a stiffener,
- wherein the integrated device die has an upper side, a lower side, and an outer side edge, the lower side comprising a first portion and means for receiving the mounting means at or near the outer side edge, wherein the integrated device die is at least as wide as the stiffener laterally, and
- wherein the mounting means comprises a first portion disposed between the first portion of the integrated device die and the package substrate and a second portion disposed along at least a portion of the means for receiving the means for mounting, the means for mounting does not extend outside of the outer side edge.
Dependencies are inferred from the claim text.