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US 11,056,446 B2Granted
Semiconductor package device and semiconductor process
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
Estimating the term…
Abstract
A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.
Claims22
A semiconductor package device, comprising:
- a wiring structure including a first insulation layer, a circuit layer in contact with the first insulation layer, and a second insulation layer disposed on the first insulation layer and covering the circuit layer;
- a semiconductor chip electrically connected to the wiring structure;
- and
- an encapsulant disposed on the wiring structure and covering the semiconductor chip, wherein a roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.
1 more element
A semiconductor package device, comprising:
- a wiring structure;
- a semiconductor chip electrically connected to the wiring structure;
- and
- a hydrophobic layer disposed on a bottom surface of the wiring structure.
1 more element
A semiconductor process, comprising:
- (a) providing a mold chase having an inner surface defining a cavity;
- (b) disposing a sacrificial layer on the inner surface of the mold chase, wherein a roughness (Ra) of the sacrificial layer is about 5 nm to about 50 nm;
- (c) disposing an encapsulant in the cavity of the mold chase to contact the sacrificial layer;
- (d) providing a wiring structure with a semiconductor chip electrically connected thereon;
- (e) disposing the wiring structure on the mold chase, such that the semiconductor chip is accommodated in the cavity of the mold chase and covered by the encapsulant;
- and
- (f) removing the mold chase and the sacrificial layer.
4 more elements
Dependencies are inferred from the claim text.