Back to results
US 11,056,442 B2Granted
Substrate structure, electronic package having the same, and method for fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPo-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
Life of this patent
Estimating the term…
Abstract
A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
Claims10
An electronic package, comprising:
- a carrier;
- a substrate body disposed on the carrier and including a first surface, a second surface opposite to the first surface, an outside surface adjoining the second surface, and an obtuse portion including a plurality of turning surfaces being planar beveled faces and formed between the outside surface and the first surface, wherein the obtuse portion extends along an edge of the first surface, a first turning surface of the plurality of turning surfaces adjoins the first surface, a second turning surface of the plurality of turning surfaces adjoins the outside surface, and the plurality of turning surfaces are made by a plurality of concave portions;
- and
- a plurality of conductive bodies bonded to the substrate body and electrically connected with the carrier,
- wherein a height of the first turning surface is less than a height of the second turning surface, and
- wherein a width of the first turning surface is greater than a width of the second turning surface.
3 more elements
Dependencies are inferred from the claim text.