Electromagnetic shielding of compact electronic modules

A method for producing an electronic module, the method comprising:

• mounting one or more electronic components on a circuit substrate comprising conductive pads and traces, including a ground pad for connection to an electrical ground;
• forming a housing from a dielectric material, while embedding a metal lead, which has first and second ends, in the dielectric material such that the first end is exposed at a lower edge of the housing, which adjoins the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material;
• depositing a conductive coating over the outer surface of the dielectric material using in galvanic contact with the exposed second end of the metal lead;
• and
• mounting the housing on the circuit substrate so that the housing covers the one or more electronic components, and the first end of the metal lead contacts the ground pad on the circuit substrate.

An electronic module, comprising:

• a circuit substrate comprising conductive pads interconnected by traces, including a ground pad for connection to an electrical ground;
• one or more electronic components mounted on the circuit substrate;
• a housing comprising a dielectric material, which is mounted on the circuit substrate so as to cover the one or more electronic components, wherein the housing contains an optical window;
• a metal lead, which has first and second ends and is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material;
• and
• a conductive coating disposed over the outer surface of the dielectric material in galvanic contact with the exposed second end of the metal lead and covering all of the housing other than the optical window.