Redistribution layer structures for integrated circuit package

An integrated circuit (IC) package, comprising:

• a conductive via having a peripheral edge;
• and
• a redistribution layer (RDL) structure, coupled to the conductive via, comprising:
• a cap region overlapping an area of the conductive via and having a diameter from a top-down view;
• a routing region having a first width from the top-down view;
• and
• an intermediate region having first and second tapered regions and arranged to couple the cap region to the routing region, the first tapered region positioned over the conductive via and the second tapered region non-overlapping with the conductive via, wherein the intermediate region has a second width from the top-down view along the peripheral edge of the conductive via, the second width being greater than the first width and less than the diameter.

An interconnect structure, comprising:

• a first conductive via;
• a second conductive via having a peripheral edge and in contact with a first side of the first conductive via;
• and
• a redistribution layer (RDL) structure in contact with a second side of the first conductive via, wherein the second side is opposite to the first side and the RDL structure comprises:
• a cap region overlapping the second conductive via and having a diameter from a top-down view;
• a routing region having a first width from the top-down view and non-overlapping with the second conductive via;
• and
• an intermediate region having a first tapered region and a second tapered region and arranged to couple the cap region to the routing region, the first tapered region overlapping with the second conductive via and the second tapered region non-overlapping with the second conductive via, wherein the intermediate region has a second width from the top-down view along the peripheral edge of the second conductive via, the second width being greater than the first width and less than the diameter.