Semiconductor device

A semiconductor device comprising:

• a mounting substrate having a metal part provided in contact with an electrode pad on a surface of the mounting substrate such that the metal part protrudes from the surface of the mounting substrate;
• a semiconductor chip having a functional element and a bump provided in contact with an element wiring line of the functional element such that the bump protrudes from a surface of the semiconductor chip;
• and
• an interposer interposed between the semiconductor chip and the mounting substrate such that the surface of the semiconductor chip having the bump provided thereon faces the surface of the mounting substrate,
• wherein the interposer has a first recess provided in a surface of the interposer facing the surface of the semiconductor chip having the bump provided thereon such that the first recess accommodates the bump, and
• wherein an interposer wiring line providing a connection between the bump protruded into the first recess and the metal part or a passive element disposed on the metal part is provided in the first recess,
• wherein a second interposer wiring line connected to the metal part is disposed on a top of the first recess, such that the second interposer wiring line receives heat from the functional element and transmits the heat to the metal part.