Semiconductor module

A semiconductor module, comprising:

• a die pad frame;
• a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed;
• a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame;
• a first clip frame disposed on the upper surface of the semiconductor chip;
• a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame;
• and
• a sealing resin for sealing the semiconductor chip, the die pad frame, the conductive connection member for die pad, the first clip frame, and the first clip conductive connection member,
• wherein the die pad frame has a projection disposed on the upper surface at an end portion of the die pad frame and protruding from an upper surface of a main body of the die pad frame in a direction that is parallel to the upper surface of the main body of the die pad frame, the projection being intended to improve the adhesion with the sealing resin,
• wherein the projection has, at its end, a locking portion that is partially located above an upper surface of the projection, and
• wherein a clip locking part is disposed at an end portion of an upper surface of the first clip frame, the clip locking part being partially above the upper surface of the first clip frame so as to be away from the upper surface of the semiconductor chip.