Package structure for power converter and manufacture method thereof
AssigneeSilergy Semiconductor Technology (Hangzhou) LTD
InventorJiaming Ye
Life of this patent
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Abstract
A package structure of a power converter, can include: a die pad; an insulation adhesive layer and a conductive adhesive layer on the die pad; a control circuit die on the insulation adhesive layer, where the insulation adhesive layer comprises a first insulation adhesive layer on a back surface of the control circuit die, and a second insulation adhesive on a surface of the die pad, where the first insulation adhesive layer is connected to the second insulation adhesive layer; and a power device die on the conductive adhesive layer, where the insulation adhesive layer is separated from the conductive adhesive layer.
Claims12
A method of making a package structure for a power converter, the method comprising:
- a) forming a conductive adhesive layer on a first region of a die pad;
- b) arranging a power device die on said conductive adhesive layer;
- c) forming an insulation adhesive layer between a back surface of a control circuit die and said die pad, wherein said insulation adhesive layer is only on a second region of said die pad;
- d) integrally forming with said die pad, a structure between said conductive adhesive layer and said insulation adhesive layer, in order to block a flow of said conductive adhesive layer;
- and
- e) arranging said control circuit die on said insulation adhesive layer, wherein said insulation adhesive layer is separated from said conductive adhesive layer, and said insulation adhesive layer comprises first and second insulation adhesive layers.
Dependencies are inferred from the claim text.