Semiconductor microcooler

An electronic system comprising:

• an integrated circuit (IC) chip thermally connected to a conduit configured to contain liquid coolant;
• a stacked semiconductor microcooler thermally connected to an internal surface of the conduit, the stack semiconductor microcooler comprising
• a first semiconductor microcooler comprising a plurality of first silicon fins and a plurality of first fin trenches, wherein each first fin trench separates adjacent first silicon fins, a first copper layer upon sidewalls of each of the plurality of first silicon fins, and a bonding layer upon a respective upper surface of each of the first plurality of silicon fins;
• a second semiconductor microcooler comprising a plurality of second silicon fins and a plurality of second fin trenches, wherein each second fin trench separates adjacent second silicon fins, and a second copper layer upon sidewalls of each of the plurality of second silicon fins;
• wherein the bonding layer connects the respective upper surface of each of the first plurality of silicon fins with a respective upper surface of each of the second plurality of silicon fins.