Back to results
US 11,056,416 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSuin Kim, Jiyong Kim, Sung-Ki Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.
Claims16
A semiconductor device comprising:
- a first case part;
- a second case part coupled to the first case part, the first and second case parts collectively providing a case;
- a semiconductor module disposed within the case and situated closer to the second case part than to the first case part;
- and
- a thermal conductor comprising a plate disposed within the case and interposed between the first case part and the semiconductor module,
- wherein the plate is thermally coupled to an outside of the semiconductor device by the first case part, and
- wherein the plate includes a first surface facing the first case part and a second surface facing the semiconductor module, and the plate has grooves in at least one of the first and second surfaces.
4 more elements
A semiconductor device comprising:
- a case including a bottom part and a top part coupled to the bottom part, the bottom part including a bottom wall of the case and the top part including a top wall of the case spaced from and disposed opposite the bottom wall;
- a semiconductor module disposed within the case, the semiconductor module having a package substrate situated closer to the top wall of the case than to the bottom wall of the case, and electronic components mounted and electrically connected to the package substrate, at least one of the electronic components comprising a semiconductor chip;
- a thermal conductor comprising a plate disposed within the case and interposed between the bottom wall of the case and the semiconductor module whereby one side of the plate faces the semiconductor module and another side of the plate faces the bottom wall of the case, the thermal conductor being thermally conductively coupled to the bottom part of the case in a region between said another side of the plate and the bottom wall of the case;
- and
- thermal interface material interposed between and thermally coupling the semiconductor module and the plate of the thermal conductor,
- wherein the plate is thermally coupled to an outside of the case by the case, and
- wherein the bottom part of the case includes a structure comprising ribs extending upright on the bottom wall of the case into contact with the thermal conductor.
4 more elements
A semiconductor device comprising:
- a case including a bottom part and a top part coupled to the bottom part, the bottom part including a bottom wall of the case and the top part including a top wall of the case spaced from and disposed opposite the bottom wall;
- a semiconductor module disposed within the case, the semiconductor module having a package substrate and electronic components mounted and electrically connected to the package substrate, at least one of the electronic components comprising a semiconductor chip;
- a thermally conductive plate disposed within the case and interposed between the bottom wall of the case and the semiconductor module, the thermally conductive plate having a top surface facing the semiconductor module and a bottom surface facing the bottom wall of the case;
- and
- thermal interface material disposed on only a portion of the top surface of the thermally conductive plate at a region vertically juxtaposed with any of the at least one of the electronic components of the semiconductor module, wherein the thermal interface material is thermally coupled to the semiconductor module and the thermally conductive plate, whereby heat
- wherein the thermally conductive plate is thermally coupled to an outside of the case by the case, and
- wherein the top surface of the thermally conductive plate includes a first region, and a second region having a surface roughness that is greater than a surface roughness of the first region, and the second region of the top surface of the thermally conductive plate contacts the thermal interface material.
4 more elements
Dependencies are inferred from the claim text.